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Global Legislation on Lead-Free Electronic Solder
The original driving force of lead-free electronics industry originated from the United States. In the late 1980s, the United States promulgated for the first time a law restricting the use of lead - the Law on Reducing Exposure and the Lead Tax Act. In 1992, the United States introduced the Reid Act, one of which was to ban the use of lead in the electronic assembly industry.
In 1998, the European Union adopted the second draft resolution of WEEE and RoHS, proposing a total ban on the use of lead-containing solders in the microelectronic assembly industry from 1 January 2004, which was later postponed to 1 January 2008. On January 27, 2003, the EU passed the 2002/96/EC Act, which clearly stipulates that the WEEE and RoHS Directives will come into force on February 13, 2003, that the products sold in the European market from July 1, 2006 must be lead-free products, and that the Member States must complete the corresponding legislative work by August 13, 2004. The instruction covers 10 kinds of electronic products such as power electronics.
Japan has been at the forefront of lead-free research and implementation in the world. In 1998, Japan Electronics Association decided to take the initiative to use lead-free solders in electronic assembly. The goal is to achieve lead-free electronic products in 2002 and completely lead-free electronic products in 2004. The Japan Electronics Industry Development Association (JEIDA) and the Japan Industrial Specification Association (JIS) have all decided on various lead-free specifications. Before that, the relevant well-known manufacturers in Japan, such as SONY, NEC, HITACHI, PA ASONIC, TOSHIBA and so on, have formulated the relevant provisions of lead ban.
China is currently the largest electronic product production base in the world. In view of the lead-free trend, the "Measures for the Prevention and Control of Pollution in Electronic Information Products" has been formulated, which stipulates that lead in electronic products is prohibited since July 1, 2006. In view of the above reasons, the development and research of lead-free solder is imminent.
